| Brand Name: | KIC |
| Model Number: | SPS Smart Profiler |
| MOQ: | 1 Piece |
| Price: | Negotiable |
| Delivery Time: | 3–7 Working Days |
| Payment Terms: | T/T |
The KIC SPS Smart Profiler is a professional multi-channel thermal profiling instrument designed to measure the actual temperature experienced by PCBs and electronic components during reflow soldering and other controlled thermal processes.
Available in 7, 9, and 12 channel standard configurations, the profiler works with standard Type K thermocouples to collect temperature data simultaneously from multiple critical locations on a PCB. KIC also lists 24-channel capability with additional hardware and software.
With factory-calibrated accuracy of plus or minus 0.5 C, 0.1 C resolution, USB communication, high-capacity data storage, and wireless capability on applicable configurations, SPS provides process engineers with practical data for analyzing peak temperature, slope, time above liquidus, and Process Window Index.
It is particularly suitable for SMT factories, EMS manufacturers, electronics assembly plants, process engineering departments, NPI teams, and reflow oven maintenance applications.
The temperature displayed on a reflow oven control panel represents the oven settings, but it does not necessarily represent the actual temperature experienced by every component on the PCB.
Different areas of a circuit board respond differently to heat because of:
For example, a large BGA or power device may heat more slowly than a small passive component. A PCB section containing heavy copper may also require more thermal energy than a low-mass section.
Without actual profile measurement, engineers may encounter problems such as:
| Process Condition | Possible Production Effect |
|---|---|
| Peak temperature too low | Insufficient solder reflow |
| Peak temperature too high | Excessive thermal exposure |
| Heating slope too fast | Increased component thermal stress |
| TAL too short | Incomplete solder wetting |
| TAL too long | Excessive heat exposure |
| Uneven PCB heating | Different component temperatures |
| Incorrect conveyor speed | Profile outside process limits |
| Recipe changed without profiling | Increased process uncertainty |
A thermal profiler provides direct product-level temperature information so engineers can evaluate the real process instead of depending only on oven settings.
The KIC SPS Smart Profiler measures multiple PCB locations during the same reflow oven pass.
Type K thermocouples are attached to selected components, soldering areas, or PCB positions. Each thermocouple connects to one input channel on the SPS profiler.
During the profiling run, temperature information is recorded throughout the heating and cooling process.
After measurement, engineers can evaluate:
The SPS can transfer stored profile data through USB, while applicable models support real-time wireless data transmission.
This provides a practical solution for establishing new reflow recipes, checking existing processes, troubleshooting thermal problems, and documenting production parameters.
| Specification | Details |
| Brand | KIC |
| Model | SPS Smart Profiler |
| Product Type | Thermal Profile Tester |
| Standard Channels | 7, 9, or 12 Channels |
| Thermocouple Type | Standard Type K |
| Measurement Accuracy | Plus or minus 0.5 C |
| Resolution | 0.1 C |
| Temperature Range | Minus 150 C to 1050 C |
| Internal Operating Temperature | 0 C to 85 C |
| Sampling Rate | 0.002 to 50 samples per second |
| Data Capacity | 72K data points per channel |
| PC Connection | USB 2.0 |
| Power Supply | Rechargeable NiMH Battery |
| Wireless Communication | Available depending on configuration |
| Main Application | Reflow Oven Thermal Profiling |
These principal measurement specifications are listed in the official SPS technical datasheet.
| Configuration | Length | Width | Height |
| SPS 7 Channel | 188 mm | 60 mm | 17 mm |
| SPS 9 Channel | 188 mm | 75 mm | 17 mm |
| SPS 12 Channel | 188 mm | 98 mm | 17 mm |
The three configurations retain the same profiler length and height, while width increases with channel quantity.
| Model | Channels | Thermocouple | Typical Selection |
| KIC SPS 7CH | 7 | Type K | Standard PCB profiling |
| KIC SPS 9CH | 9 | Type K | Additional measurement points |
| KIC SPS 12CH | 12 | Type K | Complex PCB profiling |
| SPS 24CH Capability | Up to 24 | Configuration dependent | High point count applications |
KIC identifies standard 7, 9, and 12 channel versions and also lists 24-channel capability requiring additional hardware or software.
The SPS measures the temperature actually experienced by components as a PCB passes through the reflow oven.
This provides useful process information for evaluating whether the oven recipe is suitable for the assembled board.
When a new PCB enters production, engineers can install thermocouples at selected critical locations and establish an initial thermal profile before full-scale manufacturing begins.
Profile data can help engineers evaluate changes to:
| Adjustment | Evaluation Purpose |
| Zone temperature | Control board heating |
| Conveyor speed | Adjust process duration |
| Soak section | Improve thermal balance |
| Peak zone | Control maximum temperature |
| Cooling section | Evaluate cooling behavior |
Thermal profiling can be performed after:
The SPS is suitable for:
Identify PCB locations representing different thermal characteristics, such as large IC packages, small passive components, heavy copper areas, board edges, and high-mass components.
Attach Type K thermocouples securely to each selected measurement location.
Good thermocouple contact is important because inaccurate attachment may affect the measured temperature.
Connect each thermocouple to the corresponding profiler channel.
A 7-channel SPS supports seven simultaneous measurement points, while the 9-channel and 12-channel versions provide additional inputs.
Configure the thermal profiling software with the required process parameters and profile limits.
Place the profiler inside the appropriate protective thermal shield before the assembly enters the oven.
The PCB and profiler travel through the reflow oven together.
The SPS records temperature information continuously from all connected thermocouples.
Depending on the configuration, recorded data can be downloaded through USB after the run or transmitted during the run using supported wireless communication.
Engineers can review the temperature curves and important process parameters to determine whether recipe adjustments are required.
Peak temperature represents the highest recorded temperature at each thermocouple location.
Comparing peak temperatures between components can reveal differences caused by component size and PCB thermal mass.
Heating slope indicates how rapidly the temperature changes during the heating stage.
Slope analysis helps engineers evaluate the thermal transition experienced by components.
Time above liquidus, commonly called TAL, measures how long the soldering location remains above the selected liquidus temperature.
KIC software uses Process Window Index, or PWI, to express how a measured profile fits within an established process window. A lower PWI represents a profile positioned more favorably within the defined limits.
Selecting the correct SPS configuration depends primarily on the number of temperature measurement points, PCB complexity, oven clearance, and data communication requirements.
| Item to Confirm | Why It Matters |
| Required channels | Determines profiler configuration |
| PCB dimensions | Affects measurement planning |
| Oven clearance | Determines profiler and shield suitability |
| Maximum temperature | Important for thermal protection |
| Profile duration | Helps determine thermal exposure |
| Wireless requirement | Determines communication configuration |
| Thermocouple requirement | Determines measurement setup |
| Accessories required | Helps prepare complete quotation |
Before ordering, supplying the existing profiler label or equipment photographs can also help reduce model selection errors.
The SPS is designed to record actual PCB temperatures during thermal processing and provide profile data for evaluating reflow settings, component temperatures, heating slopes, peak temperatures, and time above liquidus.
Standard SPS Smart Profiler configurations are available with 7, 9, and 12 Type K thermocouple channels. KIC also lists 24-channel capability requiring additional hardware or software.
The official specification lists factory-calibrated accuracy of plus or minus 0.5 C with a temperature resolution of 0.1 C.
Applicable SPS configurations support real-time wireless profile transmission, while stored data can also be transferred to a computer through USB. Communication configuration should be confirmed before ordering.
Please provide the required channel quantity, reflow oven model, oven clearance, process temperature, communication preference, thermal shield requirement, accessories, quantity, and any available product label photographs.
Need a KIC SPS Smart Profiler for reflow oven temperature profiling, process verification, or SMT production engineering?
Please send your required model, channel quantity, application equipment, required accessories, destination country, and order quantity.
We can assist with:
Send your inquiry with the required SPS configuration for price, availability, and technical confirmation.