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Created with Pixso. KIC SPS Smart Profiler Thermal Profile Tester for Reflow Oven

KIC SPS Smart Profiler Thermal Profile Tester for Reflow Oven

Brand Name: KIC
Model Number: SPS Smart Profiler
MOQ: 1 Piece
Price: Negotiable
Delivery Time: 3–7 Working Days
Payment Terms: T/T
Detail Information
Place of Origin:
CHINA&JAPEN
Brand:
KIC
Model:
SPS Smart Profiler
Product Name:
Thermal Profile Tester
Product Category:
SMT Peripheral Equipment
Channel Options:
7, 9, 12 Channels
Thermocouple Type:
Type K
Measurement Accuracy:
Plus Or Minus 0.5 C
Main Application:
Reflow Oven Thermal Profiling
Condition:
New Or Stock Condition As Quoted
Packaging Details:
CARTON
Supply Ability:
1000PCS/YEAR
Highlight:

KIC SPS thermal profiler for reflow oven

,

SMT reflow oven profile tester

,

thermal profile tester with warranty

Product Description
KIC SPS Smart Profiler Thermal Profile Tester for Reflow Oven
KIC SPS Smart Profiler Thermal Profile Tester for Reflow OvenKIC SPS Smart Profiler Thermal Profile Tester for Reflow OvenKIC SPS Smart Profiler Thermal Profile Tester for Reflow Oven

The KIC SPS Smart Profiler is a professional multi-channel thermal profiling instrument designed to measure the actual temperature experienced by PCBs and electronic components during reflow soldering and other controlled thermal processes.

Available in 7, 9, and 12 channel standard configurations, the profiler works with standard Type K thermocouples to collect temperature data simultaneously from multiple critical locations on a PCB. KIC also lists 24-channel capability with additional hardware and software.

With factory-calibrated accuracy of plus or minus 0.5 C, 0.1 C resolution, USB communication, high-capacity data storage, and wireless capability on applicable configurations, SPS provides process engineers with practical data for analyzing peak temperature, slope, time above liquidus, and Process Window Index.

It is particularly suitable for SMT factories, EMS manufacturers, electronics assembly plants, process engineering departments, NPI teams, and reflow oven maintenance applications.


Cause
Why Is Reflow Thermal Profiling Necessary?

The temperature displayed on a reflow oven control panel represents the oven settings, but it does not necessarily represent the actual temperature experienced by every component on the PCB.

Different areas of a circuit board respond differently to heat because of:

  • Component size and thermal mass.
  • PCB thickness.
  • Copper distribution.
  • Component density.
  • Board dimensions.
  • Conveyor speed.
  • Oven airflow.
  • Zone temperature settings.
  • Component position on the PCB.

For example, a large BGA or power device may heat more slowly than a small passive component. A PCB section containing heavy copper may also require more thermal energy than a low-mass section.

Without actual profile measurement, engineers may encounter problems such as:

Process Condition Possible Production Effect
Peak temperature too low Insufficient solder reflow
Peak temperature too high Excessive thermal exposure
Heating slope too fast Increased component thermal stress
TAL too short Incomplete solder wetting
TAL too long Excessive heat exposure
Uneven PCB heating Different component temperatures
Incorrect conveyor speed Profile outside process limits
Recipe changed without profiling Increased process uncertainty

A thermal profiler provides direct product-level temperature information so engineers can evaluate the real process instead of depending only on oven settings.


Solution

The KIC SPS Smart Profiler measures multiple PCB locations during the same reflow oven pass.

Type K thermocouples are attached to selected components, soldering areas, or PCB positions. Each thermocouple connects to one input channel on the SPS profiler.

During the profiling run, temperature information is recorded throughout the heating and cooling process.

After measurement, engineers can evaluate:

  • Peak temperature.
  • Heating slope.
  • Cooling behavior.
  • Time above liquidus.
  • Temperature differences between components.
  • Overall thermal profile shape.
  • Process Window Index.
  • Reflow recipe suitability.

The SPS can transfer stored profile data through USB, while applicable models support real-time wireless data transmission.

This provides a practical solution for establishing new reflow recipes, checking existing processes, troubleshooting thermal problems, and documenting production parameters.


Specifications
Main Technical Specifications
Specification Details
Brand KIC
Model SPS Smart Profiler
Product Type Thermal Profile Tester
Standard Channels 7, 9, or 12 Channels
Thermocouple Type Standard Type K
Measurement Accuracy Plus or minus 0.5 C
Resolution 0.1 C
Temperature Range Minus 150 C to 1050 C
Internal Operating Temperature 0 C to 85 C
Sampling Rate 0.002 to 50 samples per second
Data Capacity 72K data points per channel
PC Connection USB 2.0
Power Supply Rechargeable NiMH Battery
Wireless Communication Available depending on configuration
Main Application Reflow Oven Thermal Profiling

These principal measurement specifications are listed in the official SPS technical datasheet.

Profiler Size Comparison
Configuration Length Width Height
SPS 7 Channel 188 mm 60 mm 17 mm
SPS 9 Channel 188 mm 75 mm 17 mm
SPS 12 Channel 188 mm 98 mm 17 mm

The three configurations retain the same profiler length and height, while width increases with channel quantity.

Same Series Model Comparison
Model Channels Thermocouple Typical Selection
KIC SPS 7CH 7 Type K Standard PCB profiling
KIC SPS 9CH 9 Type K Additional measurement points
KIC SPS 12CH 12 Type K Complex PCB profiling
SPS 24CH Capability Up to 24 Configuration dependent High point count applications

KIC identifies standard 7, 9, and 12 channel versions and also lists 24-channel capability requiring additional hardware or software.


KIC SPS Smart Profiler Thermal Profile Tester for Reflow OvenKIC SPS Smart Profiler Thermal Profile Tester for Reflow Oven
Application
SMT Reflow Oven Profiling

The SPS measures the temperature actually experienced by components as a PCB passes through the reflow oven.

This provides useful process information for evaluating whether the oven recipe is suitable for the assembled board.

New Product Introduction

When a new PCB enters production, engineers can install thermocouples at selected critical locations and establish an initial thermal profile before full-scale manufacturing begins.

Reflow Recipe Optimization

Profile data can help engineers evaluate changes to:

Adjustment Evaluation Purpose
Zone temperature Control board heating
Conveyor speed Adjust process duration
Soak section Improve thermal balance
Peak zone Control maximum temperature
Cooling section Evaluate cooling behavior
Production Process Verification

Thermal profiling can be performed after:

  • Oven maintenance.
  • Recipe adjustment.
  • Production line transfer.
  • Major product change.
  • Conveyor speed modification.
  • Process troubleshooting.
Typical Users

The SPS is suitable for:

  • SMT production factories.
  • EMS companies.
  • PCBA manufacturers.
  • Electronics assembly facilities.
  • Process engineering laboratories.
  • NPI departments.
  • Quality engineering teams.
  • Reflow oven service applications.

How It Works
Step 1. Select Measurement Points

Identify PCB locations representing different thermal characteristics, such as large IC packages, small passive components, heavy copper areas, board edges, and high-mass components.

Step 2. Install Thermocouples

Attach Type K thermocouples securely to each selected measurement location.

Good thermocouple contact is important because inaccurate attachment may affect the measured temperature.

Step 3. Connect the SPS

Connect each thermocouple to the corresponding profiler channel.

A 7-channel SPS supports seven simultaneous measurement points, while the 9-channel and 12-channel versions provide additional inputs.

Step 4. Prepare the Profile

Configure the thermal profiling software with the required process parameters and profile limits.

Step 5. Install the Thermal Shield

Place the profiler inside the appropriate protective thermal shield before the assembly enters the oven.

Step 6. Run Through the Oven

The PCB and profiler travel through the reflow oven together.

The SPS records temperature information continuously from all connected thermocouples.

Step 7. Transfer Data

Depending on the configuration, recorded data can be downloaded through USB after the run or transmitted during the run using supported wireless communication.

Step 8. Analyze Results

Engineers can review the temperature curves and important process parameters to determine whether recipe adjustments are required.


Key Parameters Measured
Peak Temperature

Peak temperature represents the highest recorded temperature at each thermocouple location.

Comparing peak temperatures between components can reveal differences caused by component size and PCB thermal mass.

Heating Slope

Heating slope indicates how rapidly the temperature changes during the heating stage.

Slope analysis helps engineers evaluate the thermal transition experienced by components.

Time Above Liquidus

Time above liquidus, commonly called TAL, measures how long the soldering location remains above the selected liquidus temperature.

Process Window Index

KIC software uses Process Window Index, or PWI, to express how a measured profile fits within an established process window. A lower PWI represents a profile positioned more favorably within the defined limits.


How To Choose

Selecting the correct SPS configuration depends primarily on the number of temperature measurement points, PCB complexity, oven clearance, and data communication requirements.

Choose SPS 7 Channel If
  • You require up to seven temperature points.
  • PCB structure is relatively simple.
  • Compact profiler width is preferred.
  • Standard process verification is required.
Choose SPS 9 Channel If
  • More thermal locations must be monitored.
  • The PCB contains several different component types.
  • Additional profile detail is required.
  • Seven channels are insufficient.
Choose SPS 12 Channel If
  • The PCB has complex thermal characteristics.
  • Large boards require more measurement points.
  • Multiple high-mass and low-mass components must be compared.
  • Detailed engineering analysis is required.
Selection Checklist
Item to Confirm Why It Matters
Required channels Determines profiler configuration
PCB dimensions Affects measurement planning
Oven clearance Determines profiler and shield suitability
Maximum temperature Important for thermal protection
Profile duration Helps determine thermal exposure
Wireless requirement Determines communication configuration
Thermocouple requirement Determines measurement setup
Accessories required Helps prepare complete quotation

Before ordering, supplying the existing profiler label or equipment photographs can also help reduce model selection errors.


FAQ
Q1. What is the main purpose of the KIC SPS Smart Profiler?

The SPS is designed to record actual PCB temperatures during thermal processing and provide profile data for evaluating reflow settings, component temperatures, heating slopes, peak temperatures, and time above liquidus.

Q2. How many thermocouple channels are available?

Standard SPS Smart Profiler configurations are available with 7, 9, and 12 Type K thermocouple channels. KIC also lists 24-channel capability requiring additional hardware or software.

Q3. What is the measurement accuracy of the SPS?

The official specification lists factory-calibrated accuracy of plus or minus 0.5 C with a temperature resolution of 0.1 C.

Q4. Can profile information be transmitted wirelessly?

Applicable SPS configurations support real-time wireless profile transmission, while stored data can also be transferred to a computer through USB. Communication configuration should be confirmed before ordering.

Q5. What information should I provide for model confirmation?

Please provide the required channel quantity, reflow oven model, oven clearance, process temperature, communication preference, thermal shield requirement, accessories, quantity, and any available product label photographs.


Contact Us

Need a KIC SPS Smart Profiler for reflow oven temperature profiling, process verification, or SMT production engineering?

Please send your required model, channel quantity, application equipment, required accessories, destination country, and order quantity.

We can assist with:

  • Model confirmation.
  • Configuration matching.
  • Technical specification checking.
  • Accessory selection.
  • Stock availability.
  • Quotation support.
  • International shipment arrangements.

Send your inquiry with the required SPS configuration for price, availability, and technical confirmation.