KIC 2000 Slim 9-Channel SMT Reflow Thermal Profiler with Type K Thermocouples and ±1.2°C Accuracy

The KIC 2000 Slim 9-Channel Thermal Profiler is a professional temperature measurement and process-analysis system for SMT reflow ovens and other conveyorized thermal equipment. Using standard Type K thermocouples, it records the actual temperature experienced by different locations on a PCB while the assembly passes through the heating, soak, reflow, and cooling zones.

Unlike an oven controller, which only displays machine setpoints, the KIC 2000 measures product-level thermal performance. It helps engineers evaluate ramp rate, soak time, peak temperature, time above liquidus, cooling behavior, and temperature differences between critical PCB locations.

The system is available in data-logger and RF transmitter configurations. Depending on the installed hardware, profile data can be stored for later downloading or transmitted during the oven run. It is suitable for new product introduction, oven recipe development, periodic process verification, production troubleshooting, and thermal-process documentation.

The SlimKIC 2000 supports 9 or 12 Type K thermocouple inputs, has a specified accuracy of ±1.2°C, and operates with KIC 2000 profiling software.

The temperature displayed by an SMT reflow oven represents the setpoint or measured air temperature inside each heating zone. It does not always represent the actual temperature reached by the solder joints, component terminals, PCB surface, or heavy copper areas.

Different parts of the same PCB may heat at significantly different rates. A large connector, power component, shielded device, or heavy-copper area may remain colder than a small passive component located nearby.

This difference can create a profile that looks acceptable on the oven control panel but is unsuitable at product level.

An unsuitable reflow profile may contribute to:

• Insufficient solder wetting
• Cold solder joints
• Open circuits
• Solder balls
• Component movement
• Tombstoning
• Voiding
• Flux residue problems
• Excessive oxidation
• Board discoloration
• Delamination
• Component cracking
• Connector deformation
• Uneven solder-joint appearance
• Inconsistent production results

Without a thermal profiler, engineers may need several trial runs to identify the actual reason for these defects.

The KIC 2000 travels through the oven together with an instrumented PCB. Type K thermocouples are attached to selected product locations, allowing the system to record the temperature of each point throughout the complete thermal cycle.

This provides direct information about the actual thermal exposure of the PCB rather than relying only on oven-zone settings.

The recorded curves can be used to evaluate:

Instead of repeatedly changing oven settings without measured evidence, engineers can use the profile data to decide which parameter requires adjustment.

For example:

Final settings should always follow the solder paste specification, PCB material limits, component temperature ratings, and the approved production standard.

The manual specifies ±1.2°C accuracy, variable 0.3°C to 0.1°C resolution, a -150°C to 1050°C measurement range, a 105°C maximum internal temperature, Type K compatibility, a 9V battery, and 433.92 MHz operation for the applicable RF version.

The measurement range of the thermocouple inputs is not the same as the allowable internal temperature of the profiler.

The thermocouples can measure process temperatures far above 105°C, but the electronic recorder itself must remain within its specified internal operating limit. A correctly selected thermal shield is therefore required whenever the profiler passes through a reflow oven.

Before running a profile, confirm:

• Maximum oven temperature
• Total oven exposure time
• Conveyor speed
• Thermal shield model
• Shield insulation condition
• Profiler starting temperature
• Battery condition
• Oven clearance
• Cooling time between repeated runs

The KIC manual states that the SlimKIC 2000 should not be placed into a process that may cause its internal temperature to exceed 105°C.

These reference items are listed in the KIC 2000 hardware inventory. Actual package contents depend on the quoted configuration and should be confirmed before ordering.

For transmitter versions, the KIC 2000 records data internally while transmitting the live profile. Stored data can be used to fill transmission gaps after the run.

The KIC 2000 is suitable for developing oven recipes for new PCB assemblies. Engineers can measure the first profile, identify out-of-limit parameters, adjust zone temperatures or conveyor speed, and repeat the test until the required process window is achieved.

During NPI, the profiler helps determine whether the selected oven recipe is suitable for the PCB thickness, copper distribution, component population, solder paste, and production speed.

Lead-free processes often use higher peak temperatures and narrower process windows than traditional tin-lead applications. The profiler helps verify that all critical board locations receive sufficient heat without exceeding product limitations.

A suitable lead-free thermal shield and correctly rated thermocouples should be selected for higher-temperature processes.

The KIC 2000 can be used for:

• Daily or weekly profile checks
• Scheduled process audits
• Oven maintenance verification
• Production-line transfer
• Product changeover
• Material change verification
• Conveyor-speed confirmation
• Zone-setting verification
• Customer quality documentation
• Engineering change validation

When solder defects occur, the measured profile helps determine whether the problem may be related to thermal conditions.

It can help investigate:

• Cold joints
• Poor wetting
• Insufficient time above liquidus
• Excessive peak temperature
• Uneven heating
• Board-to-board variation
• Component overheating
• Inconsistent cooling
• Incorrect conveyor speed
• Oven-zone drift

The engineer selects or enters the required thermal limits based on:

• Solder paste specification
• Component temperature rating
• PCB material limitations
• Customer requirements
• Internal manufacturing standards
• Approved process documentation

Typical limits include maximum ramp rate, soak range, soak duration, peak temperature, time above liquidus, and cooling rate.

Thermocouples should be attached to locations that represent different thermal conditions.

Recommended locations include:

The KIC 2000 procedure requires the thermocouple connected to the first channel to be used as the air thermocouple for applicable software-guided profiles.

Thermocouple junctions must make reliable contact with the selected measurement points.

Possible attachment methods include:

• High-temperature solder
• Aluminum tape
• High-temperature adhesive
• Approved thermal cement
• Mechanical fixture methods suitable for the assembly

Loose or incorrectly attached thermocouples may record air temperature instead of the actual component or solder-joint temperature.

Each Type K thermocouple is connected to the corresponding input channel. The operator checks the channel response, battery status, internal temperature, and communication condition before starting the run.

The KIC 2000 hardware-status screen can display connected thermocouple temperatures, battery voltage, communication status, and profiler internal temperature.

The operator records:

• Number of heating zones
• Top-zone temperature settings
• Bottom-zone temperature settings
• Conveyor speed
• Zone lengths
• Product name
• Oven name
• Process-window name
• Profile notes

This information makes the profile easier to analyze, compare, and reproduce.

The profiler is installed in a thermal shield selected for the oven temperature and total process time.

The shield should be:

• Fully closed
• Clean
• Undamaged
• Cool before use
• Correctly oriented
• Within the oven clearance
• Suitable for the intended process

The instrumented PCB and protected profiler are placed on the oven conveyor.

During the run:

1. The PCB enters the preheat section.
2. Product temperatures begin to rise.
3. Different locations heat according to their thermal mass.
4. The board passes through the soak section.
5. Solder joints reach the reflow region.
6. Each thermocouple records its peak temperature.
7. The PCB enters the cooling section.
8. The profiler completes the profile recording.
9. Data is transferred to the profiling software.

The software displays individual temperature curves for the selected channels.

The engineer reviews:

• Maximum rising slope
• Soak temperature
• Soak duration
• Peak temperature
• Time above liquidus
• Maximum falling slope
• Channel differences
• Overall process-window performance

When a profile parameter is outside its limit, the engineer adjusts the relevant oven zone, conveyor speed, board orientation, or process condition.

The product is then profiled again to verify the improvement.

After obtaining an acceptable result, save:

• Product name
• Oven name
• Date
• Operator
• Zone settings
• Conveyor speed
• Thermocouple locations
• Process-window specification
• Profile graph
• Statistical results
• Product revision
• Material information
• Approval status

The saved profile becomes a reference for future production verification.

Choose the 9-channel version when:

• Standard SMT reflow profiling is required.
• The PCB has a moderate number of critical measurement locations.
• Eight product channels plus an air thermocouple are sufficient.
• A compact and practical configuration is preferred.

Consider the 12-channel version when:

• The PCB contains many different thermal masses.
• Top- and bottom-side temperatures must be compared.
• Multiple large components require separate measurement points.
• Detailed engineering validation is required.
• More hot and cold locations must be monitored in one run.

Choose a data-logger unit when:

• Live profile viewing is not essential.
• Data can be downloaded after the oven run.
• A simpler configuration is preferred.
• The profiling area has difficult wireless conditions.
• The existing system does not include a compatible receiver.

Choose an RF transmitter unit when:

• Engineers need to observe temperature curves in real time.
• Immediate feedback is useful during recipe adjustment.
• A compatible KIC receiver is available.
• Wireless communication is suitable for the production environment.
• The installed software supports the hardware configuration.

The thermal shield must match:

The SlimKIC 2000 uses an RS-232 serial connection. A serial-to-USB adapter may be required when the computer does not have a COM port.

Before ordering, confirm:

• Computer operating system
• KIC software version
• Available communication ports
• Serial-to-USB adapter compatibility
• Driver availability
• Software license status
• Receiver compatibility
• Data-storage requirements

Do not assume that every profiler includes all accessories.

Request a written packing list showing:

• KIC 2000 profiler
• Thermal shield
• Type K thermocouples
• Communication cable
• RF receiver, when required
• Receiver power supply
• Software
• Software key
• Attachment materials
• Carrying case
• User manual
• Calibration document
• Test report

Available units may be supplied in different conditions according to stock and quotation.

Possible supply conditions include:

• Original new
• Original used
• Tested used
• Refurbished
• Complete system
• Profiler only
• Hardware without software
• Hardware with selected accessories

The final condition should be clearly stated in the quotation.

For accurate production and quality-control use, confirm:

• Last calibration date
• Calibration result
• Certificate availability
• Required traceability standard
• Customer-specific calibration interval
• Channel response test
• Accuracy requirement
• Destination-country documentation

The KIC manual recommends a 12-month calibration cycle for the SlimKIC 2000 and describes calibration to ±1.2°C using a thermocouple simulator.

1. Always install the profiler inside a suitable thermal shield.
2. Never confuse the thermocouple measurement range with the profiler’s internal operating-temperature limit.
3. Do not start another profile until the profiler and thermal shield have cooled sufficiently.
4. Check thermocouple attachment before every profile run.
5. Replace damaged, oxidized, or unstable thermocouple wires.
6. Confirm battery voltage before placing the profiler into the oven.
7. Check the complete oven path for mechanical interference.
8. Confirm that the thermal shield will pass through the entrance, heating zones, cooling zones, and exit.
9. Keep the receiver and computer away from heat, flux, solder, and production hazards.
10. Save approved profiles using consistent product and oven names.
11. Use the correct solder paste and component specifications when defining the process window.
12. Do not operate the profiler if the housing, connectors, or thermal shield are damaged.
13. Keep the battery compartment clean and free from corrosion.
14. Verify all accessories before international shipment or line installation.
15. Arrange periodic calibration according to the factory quality system.

The KIC 2000 is mainly used to measure the actual temperature profile of a PCB passing through an SMT reflow oven. It helps engineers verify ramp rate, soak time, peak temperature, time above liquidus, cooling rate, and overall process-window performance.

The profiler is not limited to one specific reflow oven brand. It can be used with different conveyorized ovens when the thermal shield fits the available clearance and the process temperature, exposure time, software, and communication requirements are suitable.

The thermocouple inputs can measure temperatures from -150°C to 1050°C, but the profiler electronics must remain between 0°C and 105°C. A suitable thermal shield protects the recorder from excessive heat during the oven run.

Not necessarily. The RF transmitter requires a compatible receiver, communication cable, power supply, and suitable software configuration. Buyers should confirm every included accessory in the final quotation and packing list before ordering.

Please provide the channel quantity, data-logger or RF configuration, profiler condition, required accessories, software requirement, calibration requirement, oven brand, maximum temperature, conveyor speed, destination country, quantity, and expected delivery schedule.

Please send your detailed application and purchasing requirements for an accurate quotation.

Recommended information includes:

• Product model: KIC 2000
• Required quantity
• 9-channel or 12-channel version
• Data-logger or RF transmitter configuration
• Required product condition
• Profiler-only or complete-kit requirement
• Thermal shield requirement
• Thermocouple quantity
• RF receiver requirement
• Communication cable requirement
• Software requirement
• Software-key requirement
• Calibration certificate requirement
• Reflow oven brand and model
• Maximum process temperature
• Conveyor speed
• Available oven clearance
• Destination country
• Preferred shipping method
• Expected delivery date

Our sales team will verify the available configuration, test status, accessory list, packing method, and delivery schedule before confirming the order.