Universal 06G ESD PCB Support Module with Adaptive Retractable Multi-Pin and ESD-Safe Rubber Caps for SMT Printers

Universal 06G ESD PCB Support Module for SMT Printers and Placers

The Universal 06G ESD PCB Support Module is an adaptive multi-pin support system developed for high-density, double-sided PCB solder paste printing and component placement. Traditional rigid support pins and dedicated fixtures often require lengthy positioning, repeated adjustment, and careful avoidance of bottom-side components. Incorrect pin placement may damage electronic components, solder joints, PCB surfaces, or delicate circuit traces.

The 06G module uses individually retractable support pins fitted with wide anti-static rubber caps. When the machine platform rises, pins contacting bottom-side components automatically retract, while the remaining pins support safe areas of the PCB. After locking the module, the formed pin profile can be reused for repeated production.

Available in 200 mm and 300 mm versions, the module is suitable for selected SMT printers, pick-and-place machines, and customized PCB-handling platforms. It is particularly valuable for high-mix production, frequent line changes, double-sided assemblies, thin boards, large panels, and applications requiring fast setup with reduced operator dependence.

Standard rigid support pins must usually be positioned manually according to the bottom-side layout of each PCB. Operators need to identify safe support points, adjust individual pins, check PCB flatness, and repeat the process whenever production changes to another board.

Depending on board complexity and operator experience, traditional hard-pin setup may require approximately 30 to 150 minutes.

This downtime directly affects:

Double-sided PCBs may contain capacitors, resistors, connectors, shields, solder joints, test points, and other components underneath the board.

A rigid support pin positioned incorrectly may apply concentrated pressure to:

• Fragile electronic components.
• Fine PCB circuit traces.
• Solder joints.
• Connector housings.
• Sensitive component edges.
• Thin or flexible board areas.

This may result in cracked components, scratched PCB surfaces, broken solder joints, circuit damage, or unstable production quality.

Thin boards and large panelized PCBs may bend under printing pressure. During stencil printing, the PCB is affected by board clamping, stencil contact, squeegee movement, and stencil separation.

Without balanced underside support, the PCB may move downward or flex locally.

Common process results include:

Some production lines use dedicated PCB support fixtures for individual board models. Although these fixtures may provide stable support, they also create additional design, manufacturing, storage, and maintenance costs.

When PCB models change frequently, a dedicated fixture must be prepared for each product. This is not efficient for high-mix, low-volume manufacturing.

The Universal 06G ESD PCB Support Module replaces repeated hard-pin positioning with an adaptive mechanical support structure.

Each support pin can retract independently. When the module rises beneath the PCB, pins contacting bottom-side components move downward automatically. Pins located beneath safe board areas remain raised and provide multi-point support.

After the pin profile is formed, the operator locks the module using the mechanical lever. The locked pin arrangement functions like a customized PCB fixture and can be reused for continuous production of the same board.

When changing to another PCB, the operator releases the locking lever, resets the pin array, and repeats the forming process.

The module is placed directly on the machine support platform or between the conveyor rails, depending on the equipment structure.

Precise alignment of every individual support pin is not required. The pin array automatically forms according to the underside structure of the PCB.

This makes the product suitable for:

• Experienced SMT engineers.
• General production operators.
• Maintenance technicians.
• High-mix assembly lines.
• Contract electronics manufacturers.

Traditional rigid pin setup may require approximately 30 to 150 minutes. Under suitable operating conditions, the adaptive support profile can be formed in less than 10 seconds after the module and PCB are positioned.

Actual changeover time depends on the machine design, PCB dimensions, production procedure, and operator experience.

Faster support setup helps reduce:

The module can support different PCB:

• Lengths and widths.
• Thicknesses.
• Shapes.
• Panel layouts.
• Bottom-side component distributions.
• Production quantities.

Multiple support modules can be combined for large PCBs or long panelized boards.

The installation height can also be adjusted using optional bases manufactured according to the machine platform requirement.

Each pin is equipped with a 6 mm diameter anti-static rubber cap.

Compared with narrow rigid metal pins, the wider rubber cap distributes supporting force over a larger area. This helps reduce concentrated pressure on the PCB or suitable component surfaces.

The ESD resistance is specified below 1000 MΩ under the applicable test method and environmental conditions.

The rubber-cap design helps reduce the risk of:

• PCB surface scratching.
• Static-sensitive component exposure.
• Fine circuit damage.
• Localized mechanical pressure.
• Component breakage caused by incorrect pin location.

The square pin arrangement provides multiple supporting points beneath the PCB.

Balanced support helps maintain board flatness during:

• Stencil contact.
• Squeegee movement.
• Solder paste transfer.
• Stencil separation.
• High-speed component placement.
• PCB clamping and release.

A stable PCB position can contribute to improved printing consistency and repeatable placement performance.

The module uses a precision mechanical structure without complicated electronic control.

With correct operation, routine cleaning, and preventive maintenance, the expected operating life can reach approximately five to eight years.

Service life may vary according to:

• Production frequency.
• Working environment.
• Applied load.
• Cleaning procedures.
• Mechanical impact.
• Operator handling.
• Preventive maintenance quality.

A one-year warranty is available according to the confirmed sales agreement.

The module supports the PCB during solder paste printing. It helps maintain a stable board height while the stencil contacts the PCB and the squeegee moves across the printing area.

Suitable applications include:

• Fine-pitch PCB printing.
• High-density component boards.
• Double-sided assemblies.
• Thin PCB printing.
• Large panel printing.
• High-mix production.

The module can also provide underside support during component placement.

High-speed placement heads create repeated vertical movement. Thin or large PCBs may vibrate or deform if support is insufficient.

Multi-point support helps stabilize the board and maintain a consistent placement surface.

Double-sided PCBs are the primary application for the 06G support module.

When the module rises, pins contacting bottom-side components retract. The remaining pins support safe areas of the PCB. This allows the module to form a reusable support profile without manually positioning each rigid pin.

Factories producing many PCB models require frequent line changes.

The quick-reset pin structure allows operators to release the existing profile and create a new one rapidly, making the module suitable for:

• EMS factories.
• Contract manufacturers.
• Prototype production.
• Small-batch production.
• Multi-product assembly lines.
• Research and development workshops.

Thin circuit boards are more likely to bend during printing and placement.

Distributed support points reduce unsupported areas and help maintain PCB flatness.

Several modules can be arranged together according to the PCB length and width.

This modular installation method is suitable for:

• Long LED boards.
• Large industrial control boards.
• Multi-board panels.
• Automotive electronic assemblies.
• Power electronics PCBs.

The 06G support module can be considered for selected SMT printers, including equipment commonly associated with:

The module can also be considered for selected pick-and-place machines and PCB-handling platforms.

Compatibility depends on:

• Available installation space.
• Machine support-platform dimensions.
• Required working height.
• Conveyor width.
• PCB clamping method.
• Moving-part clearance.
• Required module quantity.

Referenced equipment names are used only to explain possible compatibility. This product is supplied as a universal compatible PCB support solution and is not represented as an original component manufactured or authorized by any referenced equipment manufacturer.

Place one or more PCB support modules on the machine support platform.

The number of modules should be selected according to the PCB size, weight, thickness, and required supporting area.

The PCB enters the printer or placement machine through the conveyor rails.

The machine positions and clamps the board according to its normal operating sequence.

The machine platform rises and brings the support pins into contact with the PCB underside.

Pins located beneath safe board areas remain extended.

Pins contacting bottom-side components retract automatically.

The pins adapt to the actual PCB underside geometry.

The resulting arrangement creates a support profile similar to a dedicated fixture.

Operate the module locking lever to retain the current pin positions.

The pin profile is now ready for repeated production.

Remove the PCB temporarily and inspect the formed support pattern.

Confirm that:

PCBs of the same model can now enter the machine and use the retained support profile without repeated pin adjustment.

Release the locking lever when changing PCB models.

Reset the pin array, load the new board, raise the platform, and lock the newly formed support profile.

The 200 mm version is recommended for smaller PCBs, narrow machine platforms, and applications requiring compact support coverage.

The 300 mm version provides a larger supporting area and a higher pin quantity for medium or large PCBs.

One module may be sufficient for a small board. Larger or longer PCBs may require two or more modules.

The module quantity depends on:

• PCB length and width.
• Board thickness.
• PCB weight.
• Bottom-side component layout.
• Required support density.
• Machine-platform dimensions.

Different machines use different PCB transport and support-platform heights.

An optional base can be added to increase the module height. Please provide the required total working height or measurements from the existing support system.

Measure the available:

• Length.
• Width.
• Height.
• Conveyor clearance.
• Clamp clearance.
• Sensor clearance.
• Moving-part clearance.

Do not select the module only according to the equipment brand.

Provide a clear bottom-side PCB photograph or drawing.

The following information is useful:

The standard anti-static rubber caps provide resistance below 1000 MΩ under applicable test conditions.

For projects requiring a specific ESD standard, resistance range, test method, certificate, or material specification, these requirements should be confirmed before ordering.

Please provide the following details for accurate product selection:

1. Stop the machine according to the equipment safety procedure.
2. Clean the support platform and remove solder paste, flux, adhesive, dust, and debris.
3. Place the module securely on the machine platform.
4. Confirm that the module does not interfere with conveyors, clamps, sensors, belts, or moving parts.
5. Check the required module height before raising the platform.
6. Install an optional height base when necessary.
7. Load a sample PCB and raise the platform slowly.
8. Allow the pins to adapt to the underside component layout.
9. Lock the module after the profile is formed.
10. Remove the PCB and inspect the pin arrangement.
11. Load the PCB again and verify flatness and stability.
12. Perform a low-speed test cycle before normal production.

Installation and testing should be completed by trained SMT operators or maintenance personnel.

Keep the module clean and dry. Do not allow hardened solder paste, adhesive, flux, or production residue to enter the pin mechanism.

Use suitable non-corrosive cleaning materials. Avoid aggressive solvents that may damage rubber caps or internal components.

Inspect every pin for smooth movement. A sticking pin may create uneven support or excessive pressure.

Check the locking mechanism regularly. Loose, worn, or damaged parts should be serviced before production continues.

Replace damaged ESD rubber caps when necessary.

Each module is cleaned and inspected before shipment.

Standard packaging includes:

• Individual protective wrapping.
• Pin and lever protection.
• Internal cushioning material.
• Reinforced export carton.
• Model and quantity identification.
• Optional wooden case for bulk shipments.

Special packaging can be arranged according to transportation requirements.

The 6 mm anti-static rubber caps provide a wider and softer contact surface than rigid metal pins. Pins also retract when contacting raised components. A production test is recommended for fragile, unusually shaped, or pressure-sensitive components.

Under suitable operating conditions, the pin profile can typically be formed in less than 10 seconds after the PCB and module are positioned. Actual time depends on the machine platform, PCB design, and operating procedure.

The module is designed as a universal support solution, but compatibility must be confirmed according to platform dimensions, working height, conveyor structure, clamp position, and available machine space.

The required quantity depends on PCB size, thickness, weight, component distribution, and support requirements. Large panels may require multiple modules for balanced underside support.

Yes. Optional bases can be supplied according to the required machine-platform height. Please provide the target total height, existing support measurements, or detailed installation drawings.

Need a faster and safer support solution for double-sided PCB printing or component placement?

Send us the following information:

• Machine brand and model.
• Equipment type.
• PCB dimensions.
• Bottom-side PCB photograph.
• Required module size.
• Required support height.
• Required quantity.
• Delivery destination.

Our team can assist with product selection, application review, module quantity recommendations, customized height bases, bulk-order quotations, export packaging, and technical guidance.

We welcome inquiries from SMT factories, electronics manufacturers, EMS companies, equipment distributors, maintenance providers, and automation integrators.

Send your PCB and machine information for a fast compatibility review and quotation.